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| Datasheet File OCR Text: |
| headquarters riverside ca www.bourns.com page 1 of 1 casrn: cas registry number is a registered trademark of the american chemical society material declaration sheet no. construction element(subpart) ho mogeneous material material weight [ mg ] homogeneous material \ substances casrn if applicable materials mass % material mass % of total unit wt. subpart mass of total wt. (%) 1 s emiconductor device silicon chip 6.68 doped silicon 7440 - 21 - 3 100 6.96 6.96 copper 7440 - 50 - 8 97.29 47.97 chromium iii 7440 - 47 - 3 0.25 0.12 tin 7440 - 31 - 5 0.25 0.12 zinc 7440 - 66 - 6 0.22 0.11 2 lead frame copper alloy with silver plating 47.28 silver (plating) 7440 - 22 - 4 2.0 0.99 49.31 3 bond wire gold w ire 0.23 gold 7440 - 57 - 5 100 0.24 0.24 di - ester resin proprietary 3 0.05 functionalized ester proprietary 7 0.13 polymeric compound proprietary 3 0.05 4 die attach adhesive 1.74 silver 7440 - 22 - 4 87 1.58 1.81 silica fused 60676 - 86 - 0 90.5 34.94 epoxy resin proprietary 4.7 1.81 phenolic resin proprietary 4.7 1.81 5 mold compound (halo gen - free) epoxy resin 37.02 carbon black 1333 - 86 - 4 0.1 0.04 38.6 6 matte tin plating matte tin 2.94 tin 7440 - 31 - 5 100 3.07 3.07 total weight 95.89 this document was updated on: january 12, 2010 important remarks: 1. it is the responsibility of the user to verify they are accessing the latest version. material number c650 - 180 - wh product line tbu compliance date january - 2008 rohs compliant yes msl 3
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